EM4069
EM4169
Packages
CID Package
PCB Package
FRONT VIEW
Y
Z
K
J
SYMBOL
MIN
TYP
8.5
MAX
8.8
TOP VIEW
B
A
B
D
e
8.2
3.8
X
4.0
4.2
5.8
6.0
6.2
0.38
1.25
0.3
0.5
0.62
1.35
0.5
F
g
1.3
0.4
MARKING
AREA
D
J
0.42
0.44
0.46
0.139
0.6
K
R
0.115 0.127
A
0.4
0.5
C2
C1
Dimensions are in mm
R
SYMBOL MIN
TYP
MAX
e
X
Y
Z
8.0
4.0
C2
C1
1.0
F
F
Dimensions are in mm
g
Fig. 17
Fig. 18
Ordering Information
Die Form
This chart shows general offering; for detailed Part Number to order, please see the table “Standard Versions” below.
EM4069 A6 WS 11 %%%
-
Circuit Nb:
Customer Version:
EM4069: standard pads
EM4169: mega pads
%%% = only for custom specific version
Version:
Bumping:
A6 = Manchester, 64 clocks per bit
A5 = Manchester, 32 clocks per bit
B6 = Bi-phase, 64 clocks per bit
B5 = Bi-phase, 32 clocks per bit
" " (blank) = no bumps (EM4069 only)
E = with Gold Bumps (for EM4169 only)
Die form:
Thickness:
WW = Wafer
7 = 7 mils (178um)
11 = 11 mils (280um)
WS = Sawn Wafer/Frame
WT = Sticky Tape
WP = Waffle Pack (note 1)
14
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