EM6603
18.1 Ordering Information
Packaged Device:
EM6603 %%% SO24 B
Customer Version:
customer-specific number
given by EM Microelectronic
Package:
SO24 = 24 pin SOIC
TP24 = 24 pin TSSOP
DL24 = 24 pin DIP (note 1)
Delivery Form:
A = Stick
B = Tape&Reel (for SO24 and TP24 only)
Device in DIE Form:
EM6603 %%% WS 11
Customer Version:
customer-specific number
given by EM Microelectronic
Die form:
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Thickness:
11 = 11 mils (280um), by default
27 = 27 mils (686um), not backlapped
(for other thickness, contact EM)
Note 1:
Please contact EM Microelectronic-Marin S.A. for availability of DIP package.
Ordering Part Number
(selected examples)
Part Number
Package/Die Form
Delivery Form/
Thickness
Stick
Tape&Reel
Tape&Reel
11 mils
11 mils
EM6603%%%SO24A
EM6603%%%SO24B
EM6603%%%TP24B
EM6603%%%WS11
EM6603%%%WP11
24 pin SOIC
24 pin SOIC
24 pin TSSOP
Sawn wafer
Die in waffle pack
Please make sure to give the complete Part Number when ordering, including the 3-digit version. The version is made of 3
digits %%%: the first one is a letter and the last two are numbers, e.g. P01 , P12, etc.
18.2 Package Marking
DIP and SOIC marking:
First line:
Second line:
Third line:
E M 6 6 0 3
0 % % Y
P P P P P P P P P P P
C C C C C C C C C C C
TSSOP marking:
E M 6 6
0 3 % %
P P P P P P P P
C C C C Y P
Where: %% = last two-digits of the customer-specific number given by EM (e.g. 05, 12, etc.)
Y = Year of assembly
PP…P = Production identification (date & lot number) of EM Microelectronic
CC…C = Customer specific package marking on third line, selected by customer
18.3 Customer Marking
There are
11
digits available for customer marking on
PDIP24
and
SO24.
There are
4
digits available for customer marking on
TSSOP24.
Please specify below the desired customer marking.
03/02 REV. G/439
Copyright
2001, EM Microelectronic-Marin SA
36
www.emmicroelectronic.com
EMMICRO [ EM MICROELECTRONIC - MARIN SA ]
