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EN25B10-75GCP 参数 Datasheet PDF下载

EN25B10-75GCP图片预览
型号: EN25B10-75GCP
PDF下载: 下载PDF文件 查看货源
内容描述: 1兆位串行闪存与引导和参数部门 [1 Mbit Serial Flash Memory with Boot and Parameter Sectors]
分类和应用: 闪存
文件页数/大小: 31 页 / 386 K
品牌: EON [ EON SILICON SOLUTION INC. ]
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EN25B10
Read Data Bytes at Higher Speed (FAST_READ) (0Bh)
The device is first selected by driving Chip Select (CS#) Low. The instruction code for the Read Data
Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-A0) and a dummy
byte, each bit being latched-in during the rising edge of Serial Clock (CLK). Then the memory contents, at
that address, is shifted out on Serial Data Output (DO), each bit being shifted out, at a maximum
frequency F
R
, during the falling edge of Serial Clock (CLK).
The instruction sequence is shown in Figure 10.. The first byte addressed can be at any location. The
address is automatically incremented to the next higher address after each byte of data is shifted out. The
whole memory can, therefore, be read with a single Read Data Bytes at Higher Speed (FAST_READ)
instruction. When the highest address is reached, the address counter rolls over to 000000h, allowing the
read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving Chip Select
(CS#) High. Chip Select (CS#) can be driven High at any time during data output. Any Read Data Bytes at
Higher Speed (FAST_READ) instruction, while an Erase, Program or Write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
13
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
Rev. B, Issue Date: 2006/12/26