MP1230A/31A/32A
ORDERING INFORMATION
Package
Type
Plastic Dip
Plastic Dip
Plastic Dip
SOIC
SOIC
SOIC
Temperature
Range
–40 to +85
°
C
–40 to +85
°
C
–40 to +85
°
C
–40 to +85
°
C
–40 to +85
°
C
–40 to +85
°
C
Part No.
MP1230ABN
MP1231ABN
MP1232ABN
MP1230ABS
MP1231ABS
MP1232ABS
INL
(LSB)
+1/2
+1
+2
+1/2
+1
+2
DNL
(LSB)
+3/4
+1
+2
+3/4
+1
+2
Gain Error
(% FSR)
+0.4
+0.4
+0.4
+0.4
+0.4
+0.4
PIN CONFIGURATIONS
CS
WR1
AGND
DB7
DB6
DB5
DB4
V
REF
R
FB
DGND
1
2
3
4
5
6
7
8
9
10
See Packaging Section for Package Dimensions
20
19
18
17
16
15
14
13
12
11
V
DD
BYTE1/BYTE2
WR2
XFER
DB8 (DB0, LSB)
DB9 (DB1)
DB10 (DB2)
DB11 MSB (DB3)
I
OUT2
I
OUT1
CS
WR1
AGND
DB7
DB6
DB5
DB4
V
REF
R
FB
DGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
DD
BYTE1/BYTE2
WR2
XFER
DB8 (DB0, LSB)
DB9 (DB1)
DB10 (DB2)
DB11 MSB (DB3)
I
OUT2
I
OUT1
20 Pin PDIP (0.300”)
N20
20 Pin SOIC (Jedec, 0.300”)
S20
PIN OUT DEFINITIONS
PIN NO.
1
2
3
4
5
6
7
8
9
10
11
NAME
CS
WR1
AGND
DB7
DB6
DB5
DB4
V
REF
R
FB
DGND
I
OUT1
DESCRIPTION
Chip Select (Active Low)
Write 1 (Active Low)
Analog Ground
Data Input Bit 7
Data Input Bit 6
Data Input Bit 5
Data Input Bit 4
Reference Input Voltage
Feedback Resistor
Digital Ground
Current Output 1
20
16
17
18
19
DB8 (DB0)
XFER
WR2
BYTE1/
BYTE2
V
DD
14
15
DB10 (DB2)
DB9 (DB1)
PIN NO.
12
13
NAME
I
OUT2
DB11 (DB3)
DESCRIPTION
Current Output 2
Data Input Bit 11 (MSB)
Data Input Bit 3
Data Input Bit 10
Data Input Bit 2
Data Input Bit 9
Data Input Bit 1
Data Input Bit 8
Data Input Bit 0 (LSB)
Transfer Control Signal (Active Low)
Write 2 (Active Low)
Byte Sequence Control
Positive Power Supply
Rev. 2.00
2
EXAR [ EXAR CORPORATION ]
