Specifications
Table 3. MC9328MXL Signal Descriptions (Continued)
Signal Name
Function/Notes
Substrate Supply Pins
SVDD
SGND
Supply routed through substrate of package; not to be bonded
Ground routed through substrate of package; not to be bonded
3 Specifications
This section contains the electrical specifications and timing diagrams for the MC9328MXL processor.
3.1 Maximum Ratings
Table 4. Maximum Ratings
Rating
Supply voltage
Maximum operating temperature range
MC9328MXLVH20/MC9328MXLVM20/
MC9328MXLVF20/MC9328MXLVP20
Maximum operating temperature range
MC9328MXLDVH20/MC9328MXLDVM20/
MC9328MXLDVF20/MC9328MXLDVP20
Maximum operating temperature range
MC9328MXLCVH15/MC9328MXLCVM15/
MC9328MXLCVF15/MC9328MXLCVP15
ESD at human body model (HBM)
ESD at machine model (MM)
Latch-up current
Storage temperature
Power Consumption
1.
2.
Symbol
V
dd
T
A
Minimum
-0.3
0
Maximum
3.3
70
Unit
V
°C
T
A
-30
70
°C
T
A
-40
85
°C
VESD_HBM
VESD_MM
ILatchup
Test
Pmax
–
–
–
-55
800
1
2000
100
200
150
1300
2
V
V
mA
°C
mW
A typical application with 30 pads simultaneously switching assumes the GPIO toggling and instruction fetches from
the ARM core-that is, 7x GPIO, 15x Data bus, and 8x Address bus.
A worst-case application with 70 pads simultaneously switching assumes the GPIO toggling and instruction fetches
from the ARM core-that is, 32x GPIO, 30x Data bus, 8x Address bus. These calculations are based on the core
running its heaviest OS application at 200MHz, and where the whole image is running out of SDRAM. QVDD at
2.0V, NVDD and AVDD at 3.3V, therefore, 180mA is the worst measurement recorded in the factory environment,
max 5mA is consumed for OSC pads, with each toggle GPIO consuming 4mA.
MC9328MXL Advance Information, Rev. 5
Freescale Semiconductor
11
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
