Thermal Characteristics
shows the thermal characteristics for the MPC860.
Table 4. MPC860 Thermal Resistance Data
Rating
Mold Compound Thickness
Junction-to-ambient
1
Natural convection
Single-layer board (1s)
Four-layer board (2s2p)
Airflow (200 ft/min)
Single-layer board (1s)
Four-layer board (2s2p)
Junction-to-board
4
Junction-to-case
5
Junction-to-package top
6
Natural convection
1
Environment
Symbol
ZP
MPC860P
0.85
ZQ / VR
MPC860P
1.15
34
22
27
18
13
8
2
Unit
mm
•C/W
C/W
R
θJA
2
R
θJMA
3
R
θJMA
3
R
θJMA
3
R
θJB
R
θJC
Ψ
JT
34
22
27
18
14
6
2
2
3
4
5
6
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad
packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from
the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
Freescale Semiconductor
9
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
