Pressure
PACKAGE DIMENSIONS
–A–
4
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
_
TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
SEATING
PLANE
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0
_
15
_
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0
_
15
_
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
N –B–
G
8
1
0.25 (0.010)
M
D
8 PL
T B
S
A
DETAIL X
S
W
V
C
PIN 1
IDENTIFIER
–T–
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPXA6115A
Sensors
Freescale Semiconductor
9
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
