6.5 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free reflow profile shown in
The recommended
standard Pb reflow profile is shown in
Temperature
60-150
sec.
20-40 sec.
260°C
250°C
3°C/sec max
217°C
6°C/sec
max
200°C
150°C
25°C
Time
60-180
sec. max
8 min. max
Figure 6-1: Maximum Pb-free
Solder
Reflow Profile (Preferred)
Temperature
60-150
sec.
10-20 sec.
230°C
220°C
3°C/sec max
183°C
6°C/sec
max
150°C
100°C
25°C
Time
120 sec. max
6
min. max
Figure 6-2:
Standard
Pb
Solder
Reflow Profile
6.6 Ordering Information
Part Number
GS2975A
GS2975A
GS2975ACNE3
GS2975ACNTE3Z
Package
Pb-free 64-pin QFN
Pb-free 64-pin QFN
2,500pc Reel
Temperature Range
0°C to 70°C
0°C to 70°C
GS2975A HD-LINX® III Multi-Rate SDI Automatic
Reclocker with Dual Differential Outputs
Data Sheet
41487 - 4
April 2009
26 of 27
GENNUM [ GENNUM CORPORATION ]
