SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Bin Code
M
N
P
Min
16.0
25.0
40.0
Including test tolerance
Bin Code
GA
GB
Min
566.0
569.0
Including±1nm test tolerance
Max
32.0
50.0
80.0
Forward Voltage(VF), Unit:V@20mA
Bin Code
4
5
6
7
Min
1.85
1.95
2.05
2.15
Including test tolerance
Max
571.0
574.0
Max
2.05
2.15
2.25
2.35
REV:A / 03
Dominant Wavelength (Hue),Unit: nm@20mA
CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult
HB’s
sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168
hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use
SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
DRAWING NO. : DS-71-03-0005
DATE : 2004-06-07
PAGE
8
HB [ HB ELECTRONIC COMPONENTS ]
