L-C150KGCT 参数 Datasheet PDF下载

SURFACE MOUNT DEVICE LED

Part No. : L-C150KGCT

Wave soldering :

Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed

consecutively cooling process is required between 1

st

and 2

nd

soldering processes.

REV:A / 03

4. Lead-Free Soldering

For Reflow Soldering :

1

、

Pre-Heat Temp:150-180

℃

,120sec.Max.

2

、

Soldering Temp:Temperature Of Soldering Pot Over 230

℃

,40sec.Max.

3

、

Peak Temperature:260

℃，

5sec.

4

、

Reflow Repetition:2 Times Max.

5

、

Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu

For Soldering Iron (Not Recommended) :

1

、

Iron Tip Temp:350

℃

Max.

2

、

Soldering Iron:30w Max.

3

、

Soldering Time:3 Sec. Max. One Time.

For Dip Soldering :

1

、

Pre-Heat Temp:150

℃

Max. 120 Sec. Max.

2

、

Bath Temp:265

℃

Max.

3、Dip Time:5 Sec. Max.

DRAWING NO. : DS-71-03-0005

DATE : 2004-06-07

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