HI-8482
THERMAL CHARACTERISTICS
PACKAGE
DESCRIPTION
PLASTIC SMALL OUTLINE (SOIC)
PLASTIC J-LEAD PLCC
CERDIP
CERAMIC SIDE-BRAZED DIP
CERAMIC J-LEAD CERQUAD
CERAMIC LCC
THERMAL
RESISTANCE
JC
17°C/W
30°C/W
28°C/W
28°C/W
25°C/W
25°C/W
JA
90°C/W
85°C/W
90°C/W
95°C/W
95°C/W
85°C/W
ORDERING INFORMATION
PART
NUMBER
HI-8482C
HI-8482CT
HI-8482D
HI-8482DT
HI-8482J
HI-8482JT
HI-8482PSI
HI-8482PST
HI-8482S
HI-8482ST
HI-8482U
HI-8482UT
PACKAGE
DESCRIPTION
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERDIP
20 PIN CERDIP
20 PIN PLASTIC J -LEAD PLCC
20 PIN PLASTIC J -LEAD PLCC
20 PIN PLASTIC SMALL OUTLINE (SOIC)
20 PIN PLASTIC SMALL OUTLINE (SOIC)
20 PIN CERAMIC LEADLESS CHIP CARRIER
20 PIN CERAMIC LEADLESS CHIP CARRIER
20 PIN J-LEAD CERQUAD
20 PIN J-LEAD CERQUAD
TEMPERATURE
RANGE
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
BURN LEAD
FLOW
IN
FINISH
I
T
M
I
T
I
T
I
T
I
T
M
I
T
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
GOLD
GOLD
SOLDER
SOLDER
SOLDER
SOLDER
SOLDER
SOLDER
GOLD
GOLD
SOLDER
SOLDER
HI-8482CM-01 20 PIN CERAMIC SIDE BRAZED DIP
YES SOLDER
HI-8482SM-01 20 PIN CERAMIC LEADLESS CHIP CARRIER
YES SOLDER
HOLT INTEGRATED CIRCUITS
7
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
