Maximum Solder Reflow Thermal Profile
260
240
∆T = 145°C, 1°C/SEC
220
200
180
160
140
120
100
80
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
CSA
The HCPL-2200/2219 have been
approved by the following
organizations:
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
UL
VDE
Recognized under UL 1577,
Component Recognition
Program, File E55361.
Approved according to VDE
0884/06.92. (HCPL-2219 Option
060 Only)
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap L(IO1)
(External Clearance)
7.1
mm
Measured from input terminals to output terminals,
shortest distance through air.
Min. External
Tracking Path
(External Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
L(IO2)
7.4
0.08
200
IIIa
mm
mm
V
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
CTI
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
1-123
HP [ HEWLETT-PACKARD ]
