Recommended Temperature Profile
B
5 sec. max.
HRS test conditions
250
200
150
100
50
Solder method
:Reflow, IR/hot air
240ç
200ç
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-2)
:Room air
Environment
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s
160ç
150ç
Part Number: OZ63-201C-50-9)
Test board
Land dimensions
:
Glass epoxy 45mm∞80mm∞1.6mm thick
:Contact Pitch 0.3mm, 0.4mm
0.3mm∞1.7mm
Contact Pitch 0.5mm
0.6mm∞1.7mm
Metal mask
:Contact Pitch 0.3mm, 0.4mm
0.25mm∞1.7mm∞0.15mm thick
Contact Pitch 0.5mm
(
30 sec.)
25ç
(20 to 30 sec.)
(60 sec.)
60 to 90 sec.
0
0.5mm∞1.7mm∞0.15mm thick
Start
60
Preheating 120
Time (sec.)
Soldering 180
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
72
HRS [ HRS ]
