Spec. No. : MOS200403
Issued Date : 2004.07.01
Revised Date : 2005.07.14
Page No. : 4/6
HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
DIM
A
C
F
G
H1
K
K1
L
M
a1
a2
Min.
6.35
4.80
1.30
5.40
6.75
0.50
0.40
0.90
2.20
0.40
-
Max.
6.80
5.50
1.70
6.25
8.00
0.90
0.90
1.50
2.40
0.65
*2.30
Marking:
A
M
Pb Free Mark
a1
F
(Note)
Pb-Free: " . "
Tab
C
H
I
Normal: None
0 2 N 6 0
Date Code
Control Code
G
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
1
2
3
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
L
a1
*: Typical, Unit: mm
K
H1
K1
3-Lead TO-251
Plastic Package
a2
a2
HSMC Package Code: I
DIM
A
B
C
D
E
F
G
H
Min.
6.40
-
5.04
-
0.40
0.50
5.90
-
-
-
-
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
*1.80
*9.30
*16.10
*0.80
0.96
*0.76
2.40
0.60
2.50
5o
A
Marking:
B
C
D
M
Pb Free Mark
F
(Note)
Pb-Free: " . "
a1
a1
H
I
Normal: None
y1
0 2 N 6 0
E
Date Code
Control Code
G
I
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
H
H1
I
J
y1
y1
Material:
J
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
K
K
K1
M
a1
a2
y1
y2
H1
2.20
0.40
2.10
-
K1
-
3o
a2
a2
a1
y2
y2
*: Typical, Unit: mm
3-Lead TO-251
Plastic Package
HSMC Package Code: I
H02N60I, H02N60J, H02N60E, H02N60F
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
