Spec. No. : MOS200611
Issued Date : 2006.06.01
Revised Date : 2006.06.28
Page No. : 3/4
HI-SINCERITY
MICROELECTRONICS CORP.
TSSOP-8 Dimension
DIM
A
A1
b
C
D
E
E1
e
Min.
-
Max.
1.20
0.15
0.3
0.20
3.10
6.60
4.50
H08N02CTS Marking:
D
0.05
0.19
0.09
2.90
6.20
4.30
Pb Free Mark
(Note)
Pb-Free: " . "
Normal: None
8
7
6
5
Control Code
Data Code
Pin 1 Index
0.65 BSC
E1
E
L
S
0.45
0.75
Pin Style: 1.D 2.S1 3.S1 4.G1 5.G2 6.S2 7.S2 8.D
Note: Green label is used for pb-free packing
Pin1
index
0o
8o
*: Typical, Unit: mm
2
3
4
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Detail F
R 0.15
A1
b
C
Seating
Plane
A
S
e
0.25
Detail F
L
8-Lead TSSOP-8 Plastic
Surface Mounted Package
HSMC Package Code: TS
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H08N02CTS
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
