HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
A
C
D
E
H
437
D
Spec. No. : HD200201
Issued Date : 2001.04.01
Revised Date : 2005.08.16
Page No. : 3/4
Marking:
L
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
I
B
1
F
H
G
M
2
3
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
K
J
N
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBD437D
HSMC Product Specification