IMP51IM11P/55121129
Package Dimensions
SOWB (16-Pin)
Inches
Min
Millimeters
Max
Min
Max
SOWB (16-Pin)
0.104
A
A1
B
0.093
0.004
0.013
0.009
0.398
0.291
2.35
0.10
0.33
0.23
2.65
0.30
0.51
0.32
10.50
7.60
0.012
E
H
0.020
C
0.013
D
0.413
0.299
10.10
7.40
E
e
0.05 BSC
1.27 BSC
D
H
0.394
0.016
0°
0.419
0.050
8°
10.00
0.40
0°
10.65
1.27
8°
M
A
L
C
L
M
*LC
e
B
16-Pin (SOWB).eps
A1
—
0.004
—
0.10
TSSOP (20-Pin)
TSSOP (20-Pin)
A
B
0.033
0.007
0.037
—
0.90
0.30
0.180
6.60
4.48
0.012
0.008
0.260
0.177
0.18
0.90
6.40
4.30
C
0.0035
0.252
0.169
D
E
F
0.025 BSC
0.65 BSC
E
P
G
H
0.002
—
0.005
0.0433
0.028
8°
0.05
—
0.15
1.10
0.70
8°
1
2
3
L
0.020
0°
0.50
0°
M
P
0.246
—
0.256
0.004
6.25
—
6.50
0.10
E
D
*LC
F
5218_t06.at3
* Lead Coplanarity* JEDEC Drawing ___________
A
H
M
L
SEATING PLANE
B
G
C
20-Pin (TSSOP).eps
Daily Silver IMP Microelectronics Co.,Ltd
7 Keda Road , Hi-Tech Park,
NingBo,Zhejiang, P.R.C.
Post Code : 315040
Tel:(086)-574-87906358
Fax:(086)-574-87908866
e-mail:sales@ds-imp.com.cn
http://www.ds-imp.com.cn
2005 Daily Silver IMP
Revision : A
Issue Date: 08 / 08 / 05
Type: Product
The IMP logo is a registered trademark of Daily Silver IMP.
All other company and product names are trademarks of their respective owners.
IMP [ IMP, INC ]
