TE28F160B3TA90 参数 Datasheet PDF下载

E

1

2

3

4

5

A

A

13

A

11

A

8

V

PP

WP#

8M

B

A

14

A

10

WE#

RP#

32M

C

A

15

A

12

A

9

A

20

A

18

D

A

16

D

14

D

5

D

11

D

2

E

V

CCQ

D

15

D

6

D

12

D

3

SMART 3 ADVANCED BOOT BLOCK

6

16M

A

19

7

8

A

7

A

4

A

17

A

5

A

2

A

6

A

3

A

1

D

8

CE#

A

0

D

9

D

0

GND

F

GND

D

7

D

13

D

4

V

CC

D

10

D

1

OE#

0580_03

NOTES:

1.

Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address

solder balls. Routing is not recommended in this area. A

19

is the upgrade address for the 16-Mbit device. A

20

is the

upgrade address for the 32-Mbit device.

2.

4-Mbit density not available in

µBGA*

CSP.

Figure 4. x16 48-Ball

µBGA*

Chip Size Package (Top View, Ball Down)

PRELIMINARY

9