E
1
2
3
4
5
A
A
13
A
11
A
8
V
PP
WP#
8M
B
A
14
A
10
WE#
RP#
32M
C
A
15
A
12
A
9
A
20
A
18
D
A
16
D
14
D
5
D
11
D
2
E
V
CCQ
D
15
D
6
D
12
D
3
SMART 3 ADVANCED BOOT BLOCK
6
16M
A
19
7
8
A
7
A
4
A
17
A
5
A
2
A
6
A
3
A
1
D
8
CE#
A
0
D
9
D
0
GND
F
GND
D
7
D
13
D
4
V
CC
D
10
D
1
OE#
0580_03
NOTES:
1.
Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address
solder balls. Routing is not recommended in this area. A
19
is the upgrade address for the 16-Mbit device. A
20
is the
upgrade address for the 32-Mbit device.
2.
4-Mbit density not available in
µBGA*
CSP.
Figure 4. x16 48-Ball
µBGA*
Chip Size Package (Top View, Ball Down)
PRELIMINARY
9