CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB to connect it. This can be important for
applications in watches and other special devices, and will also reduce mechanical stress on the device.
For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the
solder junctions by covering the rim or the corners of MS54XX ceramic substrate with glue or Globtop-like
material.
SOLDERING
Please refer to the application note AN808 for all soldering issues.
CLEANING
The MS54XX has been manufactured under cleanroom conditions. Each device has been inspected for the
homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under
class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening
during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean”
shall be used. Cleaning might damage the sensor.
RECOMMENDED PAD LAYOUT
Recommended pad layout for soldering of the MS54xx on a printed circuit board
DA54XX_011
May 9th, 2007
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000054xx280 ECN 927
INTERSEMA [ INTERSEMA SENSORIC SA ]
