SPM0408LE5H-TB
12. RELIABILITY SPECIFICATIONS
Test
Thermal Shock
High Temperature Storage
Low Temperature Storage
High Temperature Bias
Low Temperature Bias
Temperature / Humidity Bias
Vibration
ESD-HBM
ESD-LID/GND
ESD-MM
Reflow
Mechanical Shock
Description
100 cycles air-to-air thermal shock from -40
o
C to +125
o
C with 15
minute soaks. (IEC 68-2-4)
1,000 hours at +105
o
C environment (IEC 68-2-2 Test Ba)
1,000 hours at -40
o
C environment (IEC 68-2-2 Test Aa)
1,000 hours at +105
o
C under bias (IEC 68-2-2 Test Ba)
1,000 hours at -40
o
C under bias (IEC 68-2-2 Test Aa)
1,000 hours at +85
o
C/85% R.H. under bias. (JESD22-A101A-B)
4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak
acceleration lasting 12 minutes in X, Y, and Z directions.
(Mil-Std-883E, method 2007.2 A)
3 discharges of ±2 kV direct contact to I/O pins. (ESD STM5.2)
3 discharges of ±8 kV direct contact to lid while unit is grounded.
(IEC 61000-4-2)
3 discharges of ±2 kV direct contact to I/O pins.
(MIL 883E, Method 3015.7)
5 reflow cycles with peak temperature of +260
o
C
3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)
Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate
more than 3 dB from its initial value.
Revision: C
Sheet 10 of 11
2/28/2013
©2013 Knowles Electronics
KNOWLES [ KNOWLES ELECTRONICS ]
