SPM0408LE5H-TB
10. ADDITIONAL NOTES
(A) MSL (moisture sensitivity level) Class 1.
(B) Maximum of 3 reflow cycles is recommended.
(C) In order to minimize device damage:
Do not board wash or clean after the reflow process.
Do not brush board with or without solvents after the reflow process.
Do not directly expose to ultrasonic processing, welding, or cleaning.
Do not insert any object in port hole of device at any time.
Do not apply over 30 psi of air pressure into the port hole.
Do not pull a vacuum over port hole of the microphone.
Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
11. MATERIALS STATEMENT
Meets the requirements of the European RoHS directive 2011/65/EC as amended.
Meets the requirements of the industry standard IEC 61249-2-21:2003 for halogenated
substances and Knowles Green Materials Standards Policy section on Halogen-Free.
Ozone depleting substances are not used in the product or the processes used to make the
product, including compounds listed in Annex A, B, and C of the “Montreal Protocol on
Substances That Deplete the Ozone Layer.”
Revision: C
Sheet 9 of 11
2/28/2013
©2013 Knowles Electronics
KNOWLES [ KNOWLES ELECTRONICS ]
