KOA SPEER ELECTRONICS, INC.
SS-227 R2
7. Pattern design
The land pattern is recommended as follows.
0603 Chip
Mounting Side
0.6
Resist
0805 Chip
Mounting Side
0.6
Resist
1206 Chip
Mounting Side
ø 0.5 Through
Hole
1.0
1.4
0.4
1.2
2.4
ø 0.3
Through Hole
0.4
1.4
1.8
1.4
2.8
ø 0.3
Through Hole
0.8
1.0
2.4
5.0
Resist
1812 Chip
Mounting Side
ø 0.5
Through Hole
0603, 0805, 1206,
1812 Back Side
Connect to
ground pattern
of mounting side
5.0
3.0
Ground
Pattern
0.8
3.5
6.5
(unit: mm)
8. Characteristics
Item
Insulation Resistance
Capacitance
Requirement
Min 1000M ohms
Within the tolerance
Conditions
Applied rated voltage for 60 seconds.
Frequency:
1kHz
Voltage:
1Vrms
DC:
0.3V Max.
Applied 250% of the rated voltage for 1 to 5
seconds. Limit surge current 50mA max.
DC Resistance
Dielectric Withstanding
Strength
Max 60m ohms
No break down
PAGE 4 OF 8
Bolivar Drive
I
P.O. Box 547
I
Bradford, PA 16701
I
USA
I
814-362-5536
I
Fax 814-362-8883
I
www.koaspeer.com
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1.2
2.4
1.0
0.5
0.7
KOA [ KOA SPEER ELECTRONICS, INC. ]
