LT1935
TYPICAL APPLICATIO S
Efficiency, V
OUT
= 5V
5V Boost Converter
V
IN
2.3V TO 4.8V
C1
4.7µF
ON OFF
V
IN
LT1935
SHDN
GND
FB
R2
10k
L1
1.8µH
D1
V
OUT
5V
1A, V
IN
= 3.3V
0.6A, V
IN
= 2.5V
90
85
80
EFFICIENCY (%)
C1, C2: X5R OR X7R 6.3V
D1: ON SEMI MBRM120
L1: SUMIDA CR43-1R8
PACKAGE DESCRIPTIO
0.62
MAX
3.85 MAX 2.62 REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
1.00 MAX
DATUM ‘A’
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
U
SW
V
IN
= 3.3V
V
IN
= 2.5V
R1
29.4k
C3
150pF
75
70
65
60
55
C2
20µF
1935 TA01
50
0
200
400
600
800
1000
1200
LOAD CURRENT (mA)
3.3V to 12V Boost Converter
V
IN
3.3V
C1
4.7µF
ON OFF
V
IN
LT1935
SHDN
GND
FB
R2
10k
L1
4.2µH
D1
V
OUT
12V
320mA
47pF
R1
84.5k
SW
C2
22µF
D1: ON SEMI MBRM120
L1: SUMIDA CDRH5D28-4R2
1935 TA02
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
0.95
REF
2.90 BSC
(NOTE 4)
1.22 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.01 – 0.10
1.90 BSC
0.09 – 0.20
(NOTE 3)
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
S5 TSOT-23 0302
1935f
7
LINEAR [ LINEAR INTEGRATED SYSTEMS ]
