DS56 参数 Datasheet PDF下载

Pad Configuration

Figure 2. Pad Configuration.

Note for Figure 2:

1. The Thermal Pad is electrically isolated from the Anode and Cathode contact pads.

Solder Pad Design

Note for Figure 3:

The photograph below shows the recommended LUXEON Rebel layout on Printed Circuit Board (PCB). This design easily

achieves a thermal resistance of 7K/W.

Application Brief AB32 provides extensive details for this layout. In addition, the .dwg files are available upon request.

Figure 3. Solder Pad Layout.

LUXEON Rebel Datasheet DS56 (7/07)

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