Reflow Soldering Characteristics
JEDEC 020c
Table 7.
Profile Feature
Average Ramp Up Rate (Ts
max
to T
p
)
Preheat Temperature Min (Ts
min
)
Preheat Temperature Max (Ts
max
)
Preheat Time (ts
min
to ts
max
)
Time Maintained Above Temperature (T
L
)
Time Maintained Above Time (t
L
)
Peak / Classification Temperature (T
P
)
Time Within 5°C of Actual Peak Temperature (t
P
)
Ramp Down Rate
Time 25°C to Peak Temperature
Lead Free Assembly
3°C / second max
150°C
200°C
60 180 seconds
217°C
60 150 seconds
260°C
20 40 seconds
6°C / second max
8 minutes max
Notes for Table 7:
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the
package body.
LUXEON Rebel Datasheet DS56 (7/07)
9
LUMILEDS [ LUMILEDS LIGHTING COMPANY ]
