Reflow Soldering Characteristics
Temperature Profile for Table 8.
Table 10.
Profile Feature
Lead Free Assembly
Note for Table 10:
Average Ramp-Up Rate (Ts
max
to T
p
)
Preheat Temperature Min (Ts
min
)
Preheat Temperature Max (Ts
max
)
Preheat Time (ts
min
to ts
max
)
Time Maintained Above Temperature T
L
Time Maintained Above Time (t
L
)
Peak / Classification Temperature (T
P
)
Time Within 5°C of Actual Peak Temperature (t
P
)
Ramp-Down Rate
Time 25°C to Peak Temperature
3°C / second max
150°C
200°C
60 - 180 seconds
217°C
60 - 150 seconds
260°C
20 - 40 seconds
6°C / second max
8 minutes max
1. All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body.
LUXEON M Datasheet DS103 20130418 ©2013 Philips Lumileds Lighting Company.
8
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