IM Relay
General data
Operate time at
U
nom
typ. / max.
Reset time (latching) at
U
nom
, typ. / max.
Release time without diode in parallel (non-latching), typ. / max.
Release time with diode in parallel (non-latching), typ. / max.
Bounce time at closing contact, typ. / max.
Maximum switching rate without load
Ambient temperature
Thermal resistance
Maximum permissible coil temperature
Vibration resistance (function)
Shock resistance, half sinus, 11 ms
half sinus, 0.5 ms
Degree of protection / Environmental protection
Needle flame test
Mounting position
Processing information
Weight (mass)
Terminal surface
Moisture sensitive level (JEDEC J-STD-020B)
Resistance to soldering heat
All data refers to 23° C unless otherwise specified.
1 ms / 3 ms
1 ms /3 ms
1 ms / 3 ms
3 ms / 5 ms
1 ms / 5 ms
50 operations/s
-40° C ... +85° C
< 150 K/W
125° C
20 G
10 to 1000 Hz
50 G (function)
500 G (damage)
immersion cleanable, IP 67 / RT V
application time 20 s, no burning and glowing
any
Ultrasonic cleaning is not recommended
max. 0.75 g
NiPdAu
MSL 3
260° C / 10 s
Recommended soldering conditions
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Recommended reflow soldering profile
20 - 40 sec
240° C
Full line:
typical
Dotted line: process limits
Temperature °C
Temperature °C
180° C
130° C
100° C
forced
cooling
Time (s)
Time (s)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Resistance to soldering heat - Reflow profile
Temperature °C
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Time (s)
Page 8 (11)
108-98001 Rev. D
MA-COM [ M/A-COM TECHNOLOGY SOLUTIONS, INC. ]
