256Mb and 512Mb (256Mb/256Mb), P30-65nm
Features
Table 2: MCP Part Number Information
Part Number Category
Category Details
Package
RD = Micron MCP, leaded
PF = Micron MCP, lead-free
RC = 64-ball Easy BGA, leaded
PC = 64-ball Easy BGA, lead-free
48F = Micron Flash memory only
0 = No die
Product Line
Density
4 = 256Mb
Product Family
P = Micron Flash memory (P30)
0 = No die
IO Voltage and Chip Configuration
Z = Individual Chip Enables
V = Virtual Chip Enables
VCC = 1.7 to 2.0V; VCCQ = 1.7 to 3.6V
B/T = Bottom/Top parameter
Q = QUAD+
Parameter Location
Ballout
0 = Discrete
Lithography
Features
E = 65nm
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: RD48F4400P0VB0E*
Note:
Table 3: Discrete and MCP Part Combinations
Package
Density
Packing Media
Tray
Boot Configuration 1
Part Number
JS28F256P30BFE
JS
256Mb
B
Tape and Reel
Tray
JS28F256P30BFF
T
B
JS28F256P30TFE
PC
PF
256Mb
Tray
PC28F256P30BFE
PC28F256P30BFF
PC28F256P30TFE
PC48F4400P0VB0EE
PC48F4400P0VB0EF
PF48F4000P0ZBQEF
PF48F4000P0ZTQEJ
PF48F4400P0VBQEF
PF48F4400P0VBQEK
Tape and Reel
Tray
T
512Mb
(256Mb/256Mb)
Tray
B/T
Tape and Reel
Tray
256Mb
B
T
Tray
512Mb
(256Mb/256Mb)
Tray
B/T
Tape and Reel
PDF: 09005aef84566799
p30_65nm_MLC_256Mb-512mb.pdf - Rev. A 1/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
3
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