512Mb, 1Gb, 2Gb: P30-65nm
Features
Discrete and MCP Part Numbering Information
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-
ages or for further information, contact your Micron sales representative. Part numbers can be verified at
Feature and specification comparison by device type is available at
Con-
tact the factory for devices not found.
Note:
Not all part numbers listed here are available for ordering.
Table 1: Discrete Part Number Information
Part Number Category
Package
Category Details
JS = 56-lead TSOP, lead free
PC = 64-ball Easy BGA, lead-free
RC = 64-ball Easy BGA, leaded
Product Line
Density
28F = Micron Flash memory
512 = 512Mb
00A = 1Gb
00B = 2Gb
P30 (V
CC
= 1.7–2.0V; V
CCQ
= 1.7–3.6V)
B/T = Bottom/Top parameter
E = Symmetrical Blocks
F = 65nm
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: JS28F512P30EF*
Product Family
Parameter Location
Lithography
Features
Note:
Table 2: Standard Part Numbers
Density
512Mb
Configuration
Bottom boot
Top boot
Uniform
1Gb
Bottom boot
Top boot
Uniform
2Gb
Uniform
Medium
Tray
Tape & Reel
Tray
Tape & Reel
Tray
Tape & Reel
Tray
Tape & Reel
Tray
Tape & Reel
Tray
Tape & Reel
Tray
Tape & Reel
JS
JS28F512P30BFA
–
JS28F512P30TFA
–
JS28F512P30EFA
–
JS28F00AP30BFA
–
JS28F00AP30BTFA
–
JS28F00AP30EFA
–
–
–
PC
PC28F512P30BFA
PC28F512P30BFB
PC28F512P30TFA
PC28F512P30TFB
PC28F512P30EFA
–
PC28F00AP30BFA
PC28F00AP30BFB
PC28F00AP30TFA
–
PC28F00AP30EFA
–
PC28F00BP33EFA
–
RC
–
–
–
–
–
–
RC28F00AP30BFA
–
RC28F00AP30TFA
–
–
–
–
–
PDF: 09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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2013 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
