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MT41J128M8 参数 Datasheet PDF下载

MT41J128M8图片预览
型号: MT41J128M8
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM
Features
List of Figures
Figure 1: DDR3 Part Numbers .......................................................................................................................... 2
Figure 2: Simplified State Diagram ................................................................................................................. 11
Figure 3: 256 Meg x 4 Functional Block Diagram ............................................................................................. 14
Figure 4: 128 Meg x 8 Functional Block Diagram ............................................................................................. 15
Figure 5: 64 Meg x 16 Functional Block Diagram ............................................................................................. 15
Figure 6: 78-Ball FBGA – x4, x8 (Top View) ...................................................................................................... 16
Figure 7: 86-Ball FBGA – x4, x8 (Top View) ...................................................................................................... 17
Figure 8: 96-Ball FBGA – x16 (Top View) ......................................................................................................... 18
Figure 9: 78-Ball FBGA – x4, x8 (JP) ................................................................................................................ 25
Figure 10: 78-Ball FBGA – x4, x8 (HX) ............................................................................................................. 26
Figure 11: 86-Ball FBGA – x4, x8 (BY) .............................................................................................................. 27
Figure 12: 96-Ball FBGA – x16 (LA) ................................................................................................................. 28
Figure 13: 96-Ball FBGA – x16 (JT) .................................................................................................................. 29
Figure 14: Thermal Measurement Point ......................................................................................................... 33
Figure 15: Input Signal .................................................................................................................................. 49
Figure 16: Overshoot ..................................................................................................................................... 50
Figure 17: Undershoot ................................................................................................................................... 50
Figure 18: V
IX
for Differential Signals .............................................................................................................. 52
Figure 19: Single-Ended Requirements for Differential Signals ........................................................................ 52
Figure 20: Definition of Differential AC-Swing and
t
DVAC ............................................................................... 53
Figure 21: Nominal Slew Rate Definition for Single-Ended Input Signals .......................................................... 55
Figure 22: Nominal Differential Input Slew Rate Definition for DQS, DQS# and CK, CK# .................................. 56
Figure 23: ODT Levels and I-V Characteristics ................................................................................................ 57
Figure 24: ODT Timing Reference Load .......................................................................................................... 60
Figure 25:
t
AON and
t
AOF Definitions ............................................................................................................ 61
Figure 26:
t
AONPD and
t
AOFPD Definitions ................................................................................................... 61
Figure 27:
t
ADC Definition ............................................................................................................................. 62
Figure 28: Output Driver ................................................................................................................................ 63
Figure 29: DQ Output Signal .......................................................................................................................... 70
Figure 30: Differential Output Signal .............................................................................................................. 71
Figure 31: Reference Output Load for AC Timing and Output Slew Rate ........................................................... 71
Figure 32: Nominal Slew Rate Definition for Single-Ended Output Signals ....................................................... 72
Figure 33: Nominal Differential Output Slew Rate Definition for DQS, DQS# .................................................... 73
Figure 34: Nominal Slew Rate and
t
VAC for
t
IS (Command and Address – Clock) ............................................. 103
Figure 35: Nominal Slew Rate for
t
IH (Command and Address – Clock) ........................................................... 104
Figure 36: Tangent Line for
t
IS (Command and Address – Clock) .................................................................... 105
Figure 37: Tangent Line for
t
IH (Command and Address – Clock) .................................................................... 106
Figure 38: Nominal Slew Rate and
t
VAC for
t
DS (DQ – Strobe) ......................................................................... 112
Figure 39: Nominal Slew Rate for
t
DH (DQ – Strobe) ...................................................................................... 113
Figure 40: Tangent Line for
t
DS (DQ – Strobe) ................................................................................................ 114
Figure 41: Tangent Line for
t
DH (DQ – Strobe) ............................................................................................... 115
Figure 42: Refresh Mode ............................................................................................................................... 122
Figure 43: DLL Enable Mode to DLL Disable Mode ........................................................................................ 124
Figure 44: DLL Disable Mode to DLL Enable Mode ........................................................................................ 125
Figure 45: DLL Disable
t
DQSCK .................................................................................................................... 126
Figure 46: Change Frequency During Precharge Power-Down ........................................................................ 128
Figure 47: Write Leveling Concept ................................................................................................................. 129
Figure 48: Write Leveling Sequence ............................................................................................................... 132
Figure 49: Write Leveling Exit Procedure ....................................................................................................... 133
Figure 50: Initialization Sequence ................................................................................................................. 135
PDF: 09005aef826aa906
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN
8
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