2Gb: x4, x8, x16 DDR3 SDRAM
Features
Table 2: Addressing
Parameter
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
Page size
512 Meg x 4
64 Meg x 4 x 8 banks
8K
32K (A[14:0])
8 (BA[2:0])
2K (A[11, 9:0])
1KB
256 Meg x 8
32 Meg x 8 x 8 banks
8K
32K (A[14:0])
8 (BA[2:0])
1K (A[9:0])
1KB
128 Meg x 16
16 Meg x 16 x 8 banks
8K
16K (A[13:0])
8 (BA[2:0])
1K (A[9:0])
2KB
Figure 1: DDR3 Part Numbers
Example Part Number:
MT41J256M8DA-125:K
-
:
Speed
Revision
:D/:M/:K
Revision
MT41J
Configuration
Package
Configuration
512 Meg x 4
256 Meg x 8
128 Meg x 16
512M4
256M8
128M16
Temperature
Commercial
Industrial temperature
None
IT
Package
78-ball 9mm x 11.5mm FBGA
78-ball 8mm x 10.5mm FBGA
96-ball 9mm x 14mm FBGA
96-ball 8mm x 14mm FBGA
HX
DA
HA
JT
-093
-107
-125
-15E
-187E
Speed Grade
tCK = 0.938ns, CL = 14
tCK = 1.071ns, CL = 13
tCK = 1.25ns, CL = 11
tCK = 1.5ns, CL = 9
tCK = 1.87ns, CL = 7
Note:
1. Not all options listed can be combined to define an offered product. Use the part catalog search on
http://www.micron.com
for available offerings.
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
MICRON [ MICRON TECHNOLOGY ]
