Package mechanical
N25Q128 - 1.8 V
15
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in RoHS
compliant packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 114. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
8 × 6 mm, package outline
D
E
E2
e
b
A
L
ddd
A1
VDFPN-02
D2
K
L1
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 35.
VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
8 × 6 mm, package mechanical data
Millimeters
Inches
Max
1.00
0.00
0.40
8.00
5.16
6.00
4.80
1.27
0.50
–
0.82
0.45
8
0.60
0.15
8
0.020
–
(1)
Symbol
Typ
A
A1
b
D
D2
ddd
E
E2
e
K
L
L1
N
0.85
0.35
Min
Typ
0.033
0.000
0.016
0.315
0.203
0.002
0.236
0.189
0.050
–
0.032
0.018
0.024
0.006
–
0.05
0.014
Min
Max
0.039
0.002
0.019
0.05
0.48
1. D2 Max must not exceed (D – K – 2 × L).
178/185
MICRON [ MICRON TECHNOLOGY ]
