P30-65nm
Table 2:
TSOP Package Dimensions (Sheet 2 of 2)
Millimeters
Inches
Max
-
5°
0.100
0.350
Min
-
0°
-
0.006
Nom
56
3°
-
0.010
Max
-
5°
0.004
0.014
Symbol
Min
Nom
56
3°
-
0.250
N
θ
Y
Z
-
0°
-
0.150
Product Information
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
One dimple on package denotes Pin 1.
2.
If two dimples, then the larger dimple denotes Pin 1.
3.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
2.2
Figure 4:
64-Ball Easy BGA Package (512-Mbit, 1-Gbit, 2-Gbit)
Easy BGA Mechanical Specifications (8x10x1.2 mm)
S1
Ball A1
Corner
1
A
B
C
D
E
E
F
G
H
2
3
D
4
5
6
7
8
A
B
C
D
E
F
G
H
e
b
8
7
6
5
4
3
2
1
Ball A1
Corner
S2
Top View - Ball side down
Bottom View - Ball Side Up
A1
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Table 3:
Easy BGA Package Dimensions for 8x10x1.2 mm (Sheet 1 of 2)
Millimeters
Inches
Max
1.200
-
-
0.530
10.100
Min
-
0.0098
-
0.0130
0.3898
Nom
-
-
0.0307
0.0169
0.3937
Max
0.0472
-
-
0.0209
0.3976
Symbol
Min
Nom
-
-
0.780
0.430
10.000
A
A1
A2
b
D
-
0.250
-
0.330
9.900
Product Information
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Datasheet
10
Sept 2012
Order Number: 208042-06
MICRON [ MICRON TECHNOLOGY ]
