256Mb and 512Mb (256Mb/256Mb), P30-65nm
Features
Table 2: MCP Part Number Information
Part Number Category
Package
Category Details
RD = Micron MCP, leaded
PF = Micron MCP, lead-free
RC = 64-ball Easy BGA, leaded
PC = 64-ball Easy BGA, lead-free
Product Line
Density
Product Family
IO Voltage and Chip Configuration
48F = Micron Flash memory only
0 = No die
4 = 256Mb
P = Micron Flash memory (P30)
0 = No die
Z = Individual Chip Enables
V = Virtual Chip Enables
VCC = 1.7 to 2.0V; VCCQ = 1.7 to 3.6V
Parameter Location
Ballout
Lithography
Features
Note:
B/T = Bottom/Top parameter
Q = QUAD+
0 = Discrete
E = 65nm
*
1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: RC48F4400P0VB0E*
Table 3: Discrete and MCP Part Combinations
Package
JS
Density
256Mb
Packing Media
Tray
Tape and Reel
Tray
PC
256Mb
Tray
Tape and Reel
Tray
512Mb
(256Mb/256Mb)
PF
256Mb
512Mb
(256Mb/256Mb)
Tray
Tape and Reel
Tray
Tray
Tray
Tape and Reel
B
T
B/T
T
B/T
T
B
Boot Configuration
B
Part Number
JS28F256P30BFE
JS28F256P30BFF
JS28F256P30TFE
PC28F256P30BFE
PC28F256P30BFF
PC28F256P30TFE
PC48F4400P0VB0EE
PC48F4400P0VB0EF
PF48F4000P0ZBQEF
PF48F4000P0ZTQEJ
PF48F4400P0VBQEF
PF48F4400P0VBQEK
PDF: 09005aef84566799
p30_65nm_MLC_256Mb-512mb.pdf - Rev. C 12/13 EN
3
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2013 Micron Technology, Inc. All rights reserved.
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