7.5-25.0/15.0-50.0 GHz GaAs MMIC
Active Doubler
August 2007 - Rev 16-Aug-07
X1000-BD
0.295
(0.012)
0.695
(0.027)
1.620
(0.064)
Mechanical Drawing
2
3
0.791
(0.031)
1
4
0.0
0.0
7
6
5
0.894
(0.035)
1.560
(0.061)
0.196
(0.008)
0.295 0.494
(0.012) (0.019)
(Note: Engineering designator is 40DBL0458)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
Bond Pad #5 (Vg2)
Bond Pad #6 (Vss)
Bond Pad #7 (Vg1)
Bias Arrangement
Vd1
Vd2
2
3
Bypass Capacitors
- See App Note [2]
RF In
1
4
7
6
5
RF Out
Vg1
Vss
Vg2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
