MITSUBISHI <INTELLIGENT POWER MODULES>
PM50CSE060
FLAT-BASE TYPE
INSULATED PACKAGE
P
20k
≥10µ
VUP1
¡
Vcc
OUT
Si
V
D
IF
UP
VUPC
≥0.1µ
In
GND GND
Vcc
+
–
U
VVP1
OUT
Si
V
D
VP
VVPC
VWP1
In
GND GND
Vcc
V
M
OUT
Si
V
D
20k
WP
VWPC
In
GND GND
Vcc
Fo
OUT
Si
W
¡
IF
≥10µ
UN
≥0.1µ
In
GND GND
N
TEMP
Th
20k
¡
IF
≥10µ
Vcc
VN
Fo
In
OUT
Si
≥0.1µ
20k
GND GND
VN1
≥10µ
¡
Vcc
Fo
In
OUT
Si
V
D
IF
WN
≥0.1µ
VNC
GND GND
NC
NC
5V
1k
Fo
Rfo
: Interface which is the same as the U-phase
Fig. 8 Application Example Circuit
NOTES FOR STABLE AND SAFE OPERATION ;
Design the PCB pattern to minimize wiring length between opto-coupler and IPM’s input terminal, and also to minimize the
stray capacity between the input and output wirings of opto-coupler.
Quick opto-couplers: TPLH, TPLH
≤
0.8µs. Use High CMR type. The line between opto-coupler and intelligent module
should be shortened as much as possible to minimize the floating capacitance.
Slow switching opto-coupler: recommend to use at CTR = 100 ~ 200%, Input current = 8 ~ 10mA, to work in active.
Use 4 isolated control power supplies (V
D
). Also, care should be taken to minimize the instantaneous voltage charge of the
power supply.
Make inductance of DC bus line as small as possible, and minimize surge voltage using snubber capacitor between P and N
terminal.
Use line noise filter capacitor (ex. 4.7nF) between each input AC line and ground to reject common-mode noise from AC line
and improve noise immunity of the system.
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Sep. 2001
MITSUBISHI [ MITSUBISHI ELECTRIC SEMICONDUCTOR ]
