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NESB064T 参数 Datasheet PDF下载

NESB064T图片预览
型号: NESB064T
PDF下载: 下载PDF文件 查看货源
内容描述: 键入蓝色LED [TYPE BLUE LED]
分类和应用:
文件页数/大小: 13 页 / 465 K
品牌: NICHIA [ NICHIA CORPORATION ]
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Nichia STSE-CC6112A
<Cat.No.061006>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
260°C Max.
240°C Max.
10 sec. Max.
refer to
Temperature
- profile
1
.
10 sec. Max.
refer to
Temperature
- profile
2
.
(N
2
reflow is
recommended.)
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<
2
: Lead-free Solder>
<
1
: Lead Solder>
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C
60sec.Max.
Above 200
°C
120sec.Max.
1~ 5°C / sec.
240°C Max.
10sec. Max.
1~ 5°C / sec.
Pre-heating
180 ~ 200°C
60sec.Max.
Above 220
°C
120sec.Max.
260°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
9.5
4
1.5
1.5
4
2.6
4
: Solder resist
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package.
The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
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