WF5027 series
SERIES CONFIGURATION
For Fundamental Oscillator
Operating
Output drive
supply
capability
voltage range
[mA]
[V]
PAD layout
Recommended
oscillation
frequency range
*1
[MHz]
20 to 60
60 to 100
20 to 60
60 to 100
20 to 60
60 to 100
Version
*2
f
O
output
5027A1
5027AP
5027B1
5027BP
5027C1
5027CP
f
O
/2
output
5027A2
5027AQ
5027B2
5027BQ
5027C2
5027CQ
f
O
/4
output
5027A3
5027AR
5027B3
5027BR
5027C3
5027CR
f
O
/8
output
5027A4
5027AS
5027B4
5027BS
5027C4
5027CS
f
O
/16
output
5027A5
5027AT
5027B5
5027BT
5027C5
5027CT
f
O
/32
output
5027A6
5027AV
5027B6
5027BV
5027C6
5027CV
f
O
/64
output
5027A7
5027AW
5027B7
5027BW
5027C7
5027CW
Flip Chip
Bonding
1.60 to 3.63
±
4
Wire Bonding
Type I
Wire Bonding
Type II
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027
××
and chip form devices have designation CF5027
××
.
For 3rd Overtone Oscillator
Operating
Output drive
supply
capability
voltage range
[mA]
[V]
Recommended oscillation frequency range
*1
[MHz] and version
*2
PAD layout
40 to 50
Flip Chip Bonding
1.60 to 3.63
±
8
Wire Bonding Type I
Wire Bonding Type II
5027MA
5027NA
5027PA
50 to 65
5027MB
5027NB
5027PB
65 to 85
5027MC
5027NC
5027PC
85 to 110
5027MD
5027ND
5027PD
110 to 145 145 to 180
(5027QE)
(5027RE)
(5027SE)
(5027QF)
(5027RF)
(5027SF)
*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-
tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the
oscillation characteristics of components must be carefully evaluated.
*2. Wafer form devices have designation WF5027
××
and chip form devices have designation CF5027
××
.
Versions in parentheses ( ) are under development.
VERSION NAME
Device
WF5027
××
–4
Package
Wafer form
Version name
WF5027
Form WF: Wafer form
CF: Chip (Die) form
−4
Oscillation frequency range, frequency divider function
Pad layout type A, M, Q: for Flip Chip Bonding
B, N, R: for Wire Bonding (type I)
C, P, S: for Wire Bonding (type II)
CF5027
××
–4
Chip form
SEIKO NPC CORPORATION —2
NPC [ NIPPON PRECISION CIRCUITS INC ]
