LP2950/LP2951
Electrical Characteristics
Conditions
(Continued)
LP2950AC-XX
LP2951AC-XX
Tested
Tested
Typ
Limit
Design
Limit
Typ
LP2950C-XX
LP2951C-XX
Tested
Limit
Design
Limit
Units
LP2951
Parameter
Typ
Limit
(Notes 3, 16)
All Voltage Options
Temperature
Coefficient
Feedback Pin Bias
Current Temperature
Coefficient
Error Comparator
Output Leakage
Current
Output Low
Voltage
Upper Threshold
Voltage
Lower Threshold
Voltage
Hysteresis
Shutdown Input
Input
Logic
Voltage
Shutdown Pin Input
Current
Low (Regulator
ON)
High (Regulator
OFF)
V
shutdown
= 2.4V
V
shutdown
= 30V
Regulator Output
Current in Shutdown
30
450
3
1.3
0.6
2.0
50
100
600
750
10
20
3
10
20
450
600
750
3
10
20
30
50
100
450
600
750
1.3
0.7
2.0
30
50
100
1.3
0.7
2.0
V
V max
V min
µA max
µA max
µA max
µA max
µA max
µA max
15
75
V
in
= (V
O
NOM −
0.5)V
I
OL
= 400µA
60
150
V
OH
= 30V
0.01
1
2
250
400
40
25
95
140
15
75
95
140
15
60
40
25
75
95
140
150
250
400
60
40
25
0.01
1
2
150
250
400
0.01
1
2
µA max
µA max
mV max
mV max
mV min
mV min
mV max
mV max
mV
0.1
0.1
0.1
nA/˚C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 2:
Unless otherwise specified all limits guaranteed for V
IN
= (V
ONOM
+ 1)V, I
L
= 100µA and C
L
= 1µF for 5V versions and 2.2µF for 3V and 3.3V versions. Limits
appearing in
boldface
type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for T
A
= T
J
= 25˚C. Additional
conditions for the 8-pin versions are FEEDBACK tied to V
TAP
, OUTPUT tied to SENSE, and V
SHUTDOWN
≤
0.8V.
Note 3:
Guaranteed and 100% production tested.
Note 4:
Guaranteed but not 100% production tested. These limits are not used to calculate outgoing AQL levels.
Note 5:
Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential.
At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over temperature) must be taken into account.
Note 6:
Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage measured at V
in
=
(V
O
NOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = V
out
/V
ref
= (R1 + R2)/R2.For example, at a
programmed output voltage of 5V, the Error output is guaranteed to go low when the output drops by 95mV x 5V/1.235V = 384 mV. Thresholds remain constant as
a percent of V
out
as V
out
is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed.
Note 7:
V
ref
≤
V
out
≤
(V
in
− 1V), 2.3V
≤
V
in
≤
30V, 100µA
≤
I
L
≤
100mA, T
J
≤
T
JMAX
.
Note 8:
The junction-to-ambient thermal resistances are as follows: 180˚C/W and 160˚C/W for the TO-92 package with 0.40 inch and 0.25 inch leads to the printed
circuit board (PCB) respectively, 105˚C/W for the molded plastic DIP (N), 130˚C/W for the ceramic DIP (J), 160˚C/W for the molded plastic SOP (M), 200˚C/W for
the molded plastic MSOP (MM), and 160˚C/W for the metal can package (H). The above thermal resistances for the N, J, M, and MM packages apply when the
package is soldered directly to the PCB. Junction-to-case thermal resistance for the H package is 20˚C/W. Junction-to-case thermal resistance for the TO-252
package is 5.4˚C/W. The value of
θ
JA
for the LLP package is typically 51˚C/W but is dependent on the PCB trace area, trace material, and the number of layers and
thermal vias. For details of thermal resistance and power dissipation for the LLP package, refer to Application Note AN-1187.
Note 9:
May exceed input supply voltage.
7
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