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NAND01GR3B2BZA6E 参数 Datasheet PDF下载

NAND01GR3B2BZA6E图片预览
型号: NAND01GR3B2BZA6E
PDF下载: 下载PDF文件 查看货源
内容描述: 1千兆位, 2千兆位, 2112字节/ 1056字的页面, 1.8 / 3V , NAND快闪存储器 [1-Gbit, 2-Gbit, 2112-byte/1056-word page, 1.8 V/3 V, NAND flash memory]
分类和应用: 闪存存储内存集成电路
文件页数/大小: 60 页 / 1343 K
品牌: NUMONYX [ NUMONYX B.V ]
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NAND01G-B2B, NAND02G-B2C  
DC and AC parameters  
(1)  
Table 25. AC characteristics for operations  
Alt.  
1.8 V  
devices devices  
3 V  
Symbol  
Parameter  
Unit  
symbol  
tALLRL1  
tALLRL2  
tBHRL  
Read electronic signature  
Read cycle  
Min  
Min  
10  
10  
20  
25  
700  
3
10  
10  
20  
25  
700  
3
ns  
ns  
ns  
µs  
µs  
ms  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
ns  
Address Latch Low to  
Read Enable Low  
tAR  
tRR  
Ready/Busy High to Read Enable Low  
Read busy time  
Min  
tBLBH1  
tBLBH2  
tBLBH3  
Max  
Max  
Max  
Max  
Max  
Max  
Max  
Typ  
tPROG  
tBERS  
Program busy time  
Erase busy time  
Reset busy time, during ready  
5
5
Ready/Busy Low to  
Ready/Busy High  
Reset busy time, during read  
Reset busy time, during program  
Reset busy time, during erase  
5
5
tBLBH4  
tRST  
10  
500  
3
10  
500  
3
tBLBH5  
tCBSY  
Cache busy time  
Max  
Min  
700  
10  
0
700  
10  
0
tCLLRL  
tDZRL  
tEHQZ  
tRHQZ  
tCLR  
tIR  
tCHZ  
tRHZ  
Command Latch Low to Read Enable Low  
Data Hi-Z to Read Enable Low  
Min  
Chip Enable High to Output Hi-Z  
Read Enable High to Output Hi-z  
Max  
Max  
30  
30  
30  
30  
Last address latched to data loading time during program  
operations  
(2)  
tWHWH  
tADL  
Min  
100  
100  
ns  
tVHWH  
tVLWH  
tELQV  
(3)  
tWW  
Write protection time  
Min  
Max  
Min  
100  
45  
100  
25  
ns  
ns  
ns  
tCEA  
tREH  
Chip Enable Low to Output Valid  
Read Enable High to  
Read Enable High hold time  
Read Enable Low  
tRHRL  
15  
10  
tEHQX  
tRHQX  
TOH  
Chip Enable High or Read Enable high to Output Hold  
Min  
10  
10  
ns  
Read Enable Low to  
Read Enable pulse width  
Read Enable High  
tRLRH  
tRLRL  
tRP  
tRC  
Min  
Min  
25  
50  
15  
30  
ns  
ns  
Read Enable Low to  
Read cycle time  
Read Enable Low  
Read Enable access time  
Read ES access time(4)  
Read Enable Low to  
Output Valid  
tRLQV  
tREA  
Max  
Max  
30  
25  
20  
25  
ns  
µs  
Write Enable High to  
Ready/Busy High  
tWHBH  
tR  
Read busy time  
tWHBL  
tWHRL  
tWB  
Write Enable High to Ready/Busy Low  
Write Enable High to Read Enable Low  
Max  
Min  
100  
60  
100  
60  
ns  
ns  
tWHR  
1. The time to ready depends on the value of the pull-up resistor tied to the ready/busy pin. See Figure 31, Figure 32 and  
Figure 33.  
2. tWHWH is the time from W rising edge during the final address cycle to W rising edge during the first data cycle.  
3. During a program/erase enable operation, tWW is the delay from WP high to W High.  
During a program/erase disable Operation, tWW is the delay from WP Low to W High.  
4. ES = electronic signature.  
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