CSPEMI201AG
Mechanical Details
CSP Mechanical Specifications
The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP, see the California Micro Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Bumps
Millimeters
Dim
Min
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Nom
Max
Min
Nom
Max
BOTTOM VIEW
A1
C1
B2
B1
C
A2
B
A
B4
B3
Custom CSP
5
Inches
0.885 0.930 0.975 0.0348 0.0366 0.0384
1.365 1.410 1.455 0.0537 0.0555 0.0573
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
1 2 3
SIDE
VIEW
C2
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.220 0.270 0.320 0.0087 0.0106 0.0126
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
3500 pieces
D1
0.30 DIA.
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI201AG Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
Rev.
3
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