MC10E131, MC100E131
Table 6. 100E SERIES NECL DC CHARACTERISTICS
V
CCx
= 0.0 V; V
EE
=
−5.0
V (Note 7)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
Characteristic
Power Supply
Current
Output HIGH
Voltage (Note 8)
Output LOW
Voltage (Note 8)
Input HIGH Volt-
age
Input LOW Volt-
age
Input HIGH Cur-
rent
C
C
S
R, CE
D
Input LOW Cur-
rent
−1025
−1645
Min
Typ
58
Max
70
−1025
−1810
−1165
−1810
Min
0°C
Typ
58
−950
−1705
−1025
−1645
Max
70
−880
−1620
−880
−1475
−1025
−1810
−1165
−1810
Min
25°C
Typ
58
−950
−1745
−1025
−1645
Max
70
−880
−1620
−880
−1475
−1025
−1810
−1165
−1810
Min
85°C
Typ
67
−950
−1740
−1025
−1645
Max
81
−880
−1620
−880
−1475
Unit
mA
mV
mV
mV
mV
mA
350
450
300
150
0.5
0.3
350
450
300
150
0.5
0.25
350
450
300
150
0.5
0.2
350
450
300
150
mA
I
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary
−0.46
V / +0.8 V.
8. Outputs are terminated through a 50
W
resistor to V
CC
−
2.0 V.
Table 7. AC CHARACTERISTICS
V
CCx
= 5.0 V; V
EE
= 0.0 V or V
CCx
= 0.0 V; V
EE
=
−5.0
V (Note 7)
−40°C
Symbol
f
MAX
t
PLH
t
PHL
Characteristic
Maximum Toggle Frequency
Propagation Delay to Output
C
C
R
S
Setup Time (Note 10)
Hold Time (Note 10)
Reset Recovery Time
Minimum Pulse Width
R, S
Within-Device Skew (Note 11)
Random Clock Jitter
Rise/Fall Time (20−80%)
275
CLK
CE
Min
1100
310
275
400
300
200
225
450
400
400
60
<1
460
725
300
Typ
1400
600
600
635
550
20
−20
150
750
725
875
775
Max
Min
1100
360
325
450
350
150
175
400
400
400
60
<1
480
300
25°C
Typ
1400
500
500
640
550
20
−20
150
700
675
825
725
Max
Min
1100
360
325
450
350
150
175
400
400
400
60
<1
480
675
85°C
Typ
1400
500
500
640
550
20
−20
150
700
675
825
725
Max
Unit
MHz
ps
t
S
t
H
t
RR
t
PW
t
SKEW
t
JITTER
D
D
ps
ps
ps
ps
ps
ps
ps
t
r
/t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: V
EE
can vary
−0.46
V / +0.06 V.
100 Series: V
EE
can vary
−0.46
V / +0.8 V.
10. Setup/hold times guaranteed for both C
C
and CE.
11. Within-device skew is defined as identical transitions on similar paths through a device.
http://onsemi.com
5
ONSEMI [ ON SEMICONDUCTOR ]
