SFH 4253
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
255 ˚C
240 ˚C
217 ˚C
200
30 s max
150
120 s max
100
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
100 s max
Ramp Down
6 K/s (max)
10 s min
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
T
250
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
260 ˚C
+0˚C
-5
245 ˚C
±5 ˚C
˚C
235 ˚C
+5˚C
-0
50
t
Wellenlöten (TTW)
TTW Soldering
300
C
T
250
235 C ... 260 C
2. Welle
2. wave
200
1. Welle
1. wave
150
100 C ... 130 C
100
2 K/s
50
Zwangskühlung
forced cooling
ca 200 K/s
5 K/s
2 K/s
(nach CECC 00802)
(acc. to CECC 00802)
OHLY0598
10 s
Normalkurve
standard curve
Grenzkurven
limit curves
0
0
50
100
150
t
200
s
250
2009-08-25
8
OSRAM [ OSRAM GMBH ]
