SFH 9202
Löthinweise
Soldering Conditions
Bauform
Type
Drypack
Level acc.
to
IPS-stand.
020
4
Tauch-, Schwalllötung
Dip, Wave Soldering
Reflowlötung
Reflow Soldering
Kolbenlötung
Iron Soldering
(Iron temp.)
Peak Temp. Max. Time in Peak Temp. Max. Time
(solderbath) peak zone
(package
in Peak
temp.)
Zone
n. a.
–
260
°C
20 sec.
SFH 9202
n.a.
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 4
Preconditioning acc. to JEDEC Level 4
(nach J-STD-020C)
(acc. to J-STD-020C)
300
˚C
255 ˚C
240 ˚C
217 ˚C
200
OHLA0687
T
250
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
260 ˚C
+0˚C
-5
245 ˚C
±5 ˚C
˚C
235 ˚C
+5˚C
-0
10 s min
30 s max
150
120 s max
100
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
100 s max
Ramp Down
6 K/s (max)
50
250
s
300
t
2007-04-03
10
OSRAM [ OSRAM GMBH ]
