PE64907
Product Specification
Figure 3. Pin Configuration (Top View)
Table 3. Operating Ranges
Parameter
Supply voltage
Supply current (V
DD
= 2.75V)
Standby current (V
DD
= 2.75V)
Control voltage high
Control voltage low
RF input power (50Ω)
1
698 - 915 MHz
1710 - 1910 MHz
Peak operating RF voltage
2
V
P
to V
M
V
P
to RFGND
Operating temperature range
T
OP
T
ST
-40
-65
+25
+25
Symbol
V
DD
I
DD
I
DD
V
IH
V
IL
1.2
0
Min
2.30
Typ
2.75
140
25
1.8
0
3.1
0.57
+34
+32
30
30
+85
+150
Max
4.80
200
Unit
V
µA
µA
V
V
dBm
dBm
Vpk
Vpk
°C
°C
Table 2. Pin Descriptions
Pin #
1
2
3
4
5
6
7
8
9
10
Pad
Pin Name
RF-
RF-
GND
V
DD
SCL
SEN
SDA
RF+
RF+
GND
GND
Description
Negative RF port
1
Negative RF port
1
Ground
2
Power supply pin
Serial interface clock input
Serial interface latch enable input
Serial interface data input
Positive RF port
1
Positive RF port
Ground
2
1
Storage temperature range
Notes:
1. Maximum power available from 50Ω source. Pulsed RF input with
4620 µS period, 50% duty cycle, measured per 3GPP TS 45.005
measured in shunt between 50Ω ports, RF- connected to GND
2. Node voltages defined per Equivalent Circuit Model Schematic
(Figure
13).
When DTC is used as a part of reactive network,
impedance transformation may cause the internal RF voltages (V
P
, V
M
)
to exceed peak operating RF voltage even with specified RF input
power levels. For operation above about +20 dBm (100 mW), the
complete RF circuit must be simulated using actual input power and
load conditions, and internal node voltages (V
P
, V
M
in
Figure 13)
monitored to not exceed 30 V
pk
Table 4. Absolute Maximum Ratings
Parameter/Condition
ESD Voltage HBM
1
Symbol
V
ESD
Min
Max
2000
Unit
V
Note 1: Human Body Model (MIL-STD-883 Method 3015.7)
Exposed pad: ground for proper operation
2
Notes: 1. For optimal performance, recommend typing Pins 1-2 and Pins 8-9
together on PCB
2. For optimal performance, recommend tying Pins 3, 10, and
exposed ground pad together on PCB
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE64907 in the 10-lead 2 x 2 x 0.55 mm QFN
package is MSL1.
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted
to the limits in the Operating Ranges table.
Operation between operating range maximum and
absolute maximum for extended periods may
reduce reliability.
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS
®
device, observe
the same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS
®
devices are immune to latch-up.
Document No. DOC-30214-2
│
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