4.6 Small Outline (SO) Package
L
D
ß×45º
e
2a W
ø
E
M
Seating level
h H
Base level
SYMBOL
M
W
2a
H
h
D
L
E
e
B
o
Min
8.56
5.79
3.81
1.35
0.10
1.27
0.36
0.41
0.20
0.25
0
Package Type: 14 Pin SOIC
Millimeters
Max
Notes
Min
8.81
6.20
3.99
1.75
0.25
1.27
0.51
1.27
0.25
0.51
8
0.337
0.228
0.150
0.31
0.004
0.050
0.014
0.016
0.008
0.014
0
Inches
Max
0.347
0.244
0.157
0.33
0.010
0.050
0.020
0.050
0.010
0.020
8
Notes
BSC
BSC
4.7 TSSOP Package
E
E1
D
2
n
1
B
a
A
c
L
A1
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Standoff
Overall W idth
Moulded Package W idth
Moulded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead W idth
Mould Draft Angle Top
Mould Draft Angle Bottom
MIN
n
p
A
A1
E
E1
D
L
c
B
a
INCHES
NOM
14
0.026
0.004
0.251
0.173
0.197
0.024
4
0.006
0.010
5
5
MAX
MIN
0.002
0.246
0.169
0.193
0.020
0
0.004
0.007
0
0
0.043
0.006
0.256
0.177
0.201
0.028
8
0.008
0.012
10
10
0.05
6.25
4.30
4.90
0.50
0
0.09
0.19
0
0
MILLIMETERS
NOM
MAX
14
0.65
1.10
0.10
0.15
6.38
6.50
4.40
4.50
5.00
5.10
0.60
0.70
4
8
0.15
0.20
0.25
0.30
5
10
5
10
lQ
11
QT510 R6.04/0505
QUANTUM [ QUANTUM RESEARCH GROUP ]
