FM25L16
8-pin TDFN (3.0mm x 6.4mm body, 0.65mm pitch)
6.40 ±0.1
Exposed
metal pad.
Do not
connect to
anything,
except Vss.
Pin 1 ID
Pin 1
3.00 ±0.1
0.0 - 0.05
0.75 ±0.05
0.20 REF.
0.65
0.25 ±0.05
3.10
0.40 ±0.1
Recommended PCB Footprint
1.10
6.70
0.60
0.65
0.30
Note: All dimensions in millimeters. This package is footprint compatible with the 8-pin TSSOP.
TDFN Package Marking Scheme for Body Size 3mm x 6.4mm
Legend:
RIC=Ramtron Int’l Corp, G=”green” TDFN package
XXXX=base part number
LLLL= lot code
YY=year, WW=work week
Example: “Green” TDFN package, FM25L16, Lot 0003, Year 2004, Work Week 38
RICG
5L16
0003
0438
RICG
XXXX
LLLL
YYWW
Rev. 3.0
Aug. 2006
Page 13 of 14
RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
