X28HC256
Ordering Information
(Continued)
PART NUMBER
X28HC256PIZ-12 (Note)
X28HC256S-12*
X28HC256SZ-12 (Note)
X28HC256SI-12*
X28HC256SIZ-12 (Note)
X28HC256SM-12*, **
X28HC256D-90
X28HC256DI-90
X28HC256DM-90
X28HC256DMB-90
X28HC256EM-90
X28HC256EMB-90
X28HC256FI-90
X28HC256FM-90
X28HC256FMB-90
X28HC256J-90*
X28HC256JZ-90* (Note)
X28HC256JI-90*
X28HC256JIZ-90* (Note)
X28HC256JM-90*
X28HC256KM-90
X28HC256KMB-90
X28HC256P-90
X28HC256PZ-90 (Note)
X28HC256PI-90
X28HC256PIZ-90 (Note)
X28HC256S-90*
X28HC256SI-90*
X28HC256SIZ-90 (Note)
X28HC256SI-20T1
*Add "T1" suffix for tape and reel.
**Add "T2" suffix for tape and reel.
***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PART MARKING
X28HC256PI-12 RRZ
X28HC256S-12 RR
X28HC256S-12 RRZ
X28HC256SI-12 RR
X28HC256SI-12 RRZ
X28HC256SM-12 RR
X28HC256D-90 RR
X28HC256DI-90 RR
X28HC256DM-90 RR
C X28HC256DMB-90
X28HC256EM-90 RR
C X28HC256EMB-90
X28HC256FI-90 RR
X28HC256FM-90 RR
C X28HC256FMB-90
X28HC256J-90 RR
X28HC256J-90 ZRR
X28HC256JI-90 RR
X28HC256JI-90 ZRR
X28HC256JM-90 RR
X28HC256KM-90 RR
C X28HC256KMB-90
X28HC256P-90 RR
X28HC256P-90 RRZ
X28HC256PI-90 RR
X28HC256PI-90 RRZ
X28HC256S-90 RR
X28HC256SI-90 RR
X28HC256SI-90 RRZ
200
90
90
120
ACCESS TIME
(ns)
TEMP. RANGE
(°C)
-40 to +85
0 to +70
0 to +70
-40 to +85
-40 to +85
-55 to +125
0 to +70
-40 to +85
-55 to +125
MIL-STD-883
-55 to +125
MIL-STD-883
-40 to +85
-55 to +125
MIL-STD-883
0 to +70
0 to +70
-40 to +85
-40 to +85
-55 to +125
-55 to +125
MIL-STD-883
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
-40 to +85
-40 to +85
PACKAGE
28 Ld PDIP (Pb-free)***
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld SOIC (300 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
28 Ld CERDIP (520 mils)
32 Ld LCC (458 mils)
32 Ld LCC (458 mils)
28 Ld FLATPACK (440 mils)
28 Ld FLATPACK (440 mils)
28 Ld FLATPACK (440 mils)
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC
28 Ld PGA
28 Ld PGA
28 Ld PDIP
28 Ld PDIP (Pb-free)***
28 Ld PDIP
28 Ld PDIP (Pb-free)**
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils)
28 Ld SOIC (300 mils) (Pb-free)
28 Ld SOIC (300 mils) Tape and Reel
N32.45x55
N32.45x55
N32.45x55
N32.45x55
N32.45x55
G28.550x650A
G28.550x650A
E28.6
E28.6
E28.6
E28.6
MDP0027
MDP0027
MDP0027
MDP0027
PKG. DWG. #
E28.6
MDP0027
MDP0027
MDP0027
MDP0027
MDP0027
F28.6
F28.6
F28.6
F28.6
3
FN8108.2
May 7, 2007
ROCHESTER [ Rochester Electronics ]
