Typical Characteristics (continued)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
∗
Note :
1. VGS = 10 V
2. ID = 9.5 A
-100
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
20
16
12
8
Operation in This Area
is Limited by R DS(on)
102
10 μs
100 μs
1 ms
101
10 ms
100 ms
DC
100
10-1
* Notes :
4
1. TC = 25 o
C
2. TJ = 150 o
C
3. Single Pulse
10-2
100
0
25
101
102
103
50
75
100
125
150
TC, Case Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
1 0 0
D = 0 .5
1 0 -1
0 .2
*
N o te s
1 . Z θ J C (t)
2 . D u ty F a c to r, D = t1 /t2
:
=
0 .5 2 o C /W M a x.
0 .1
0 .0 5
3 . T J M
-
T C = P D M * Z θ J C (t)
0 .0 2
0 .0 1
PDM
1 0 -2
s in g le p u ls e
t1
t2
1 0 -5
1 0 -4
1 0 -3
1 0 -2
1 0 -1
1 0 0
1 0 1
t1 , S q u a re W a ve P u ls e D u ra tio n [s e c ]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,Nov 2009
SEMIHOW [ SEMIHOW CO.,LTD. ]
